In an earlier blog post we discussed why micron-scale circuits tend to perform better when made using an additive versus a subtractive process. The additive process defines circuit lines by adding (electroplating) conductive material on top of a thin metal film that’s been sputtered onto a substrate. The subtractive process defines circuit lines by removing (chemical etching) conductive material out of a thick metal film that’s been sputtered onto a substrate. The places where metal is either added or subtracted are defined by a stencil of photoresist material that remains on the metal film following photolithography.
Topics: thin film